The IONIX® RIX®12 magnetron sputtering source has a target diameter of 300 mm and can be used with targets of 6 – 16 mm thickness.

Demonstrates an impressive uniformity of up to +/-1%, guaranteeing consistent deposition across the 8-inch wafer. The unique feature of the RIX®12 is its 100% Full Face Erosion capability. Unlike other systems, it avoids the formation of any redeposition zones on the target surface. This characteristic is crucial for maintaining stable processes over extended periods, contributing to prolonged maintenance cycles. The absence of redeposition zones ensures the stability of processes and extends the time between services.

For reactive processes we suggest to add our „Hidden Anode“. Combined with the 100% FFE, the RIX®12 enables cutting edge processing. This innovative technology enhances any system‘s capabilities for advanced manufacturing applications.