IONIX® UHV Circular Sputtering Sources
IONIX® ultrahigh vacuum sputtering sources are available in a wide range of target sizes from 1” up to 12” diameter. With our profund knowledge of sputtering technology and our experience we are capable for special designs to serve almost any need and vacuum environment.
IONIX® ultrahigh vacuum sputtering sources only contain metallic seals and can be baked with their magnet array up to 200°C. This feature enables sputter deposition in an ultra pure environment eliminating unintenional oxidation and nitridation of materials.
IONIX® ultrahigh vacuum sputtering sources offer a wide range of magnetic and mechanical options, e.g. flange/internal mounted, tilt able/adjustable, magnetrons with electropneumatic shutters, balanced/unbalanced magnet arrays, magnet arrays for high target utilization, for enhanced film thickness uniformity or low operating pressure.
Features
- Target-Ø 25.4 – 300 mm (1” – 12”)
- Standardized interfaces (CF)
- For use with DC-, RF- or HiPIMS processes
- For fundamental research
- Particular features:
- metallic seals vacuum-to-atmosphere
- no water-to-vacuum seals
- magnets separated from cooling water
- with magnets bakeable up to 200°C
Mechanical and mounting options
- with or without chimney
- +/- 45° tilt or 40° insitu-tilt
- Pneumatic, electric or manual shutter
- Gas distribution
- Quick coupling feedtrough for wall-mounting
- Z-Manipulator
- Flange mounting option
- RF-Power option
Magnetic options
- balanced/unbalanced
- high target utilization
- high film thickness uniformity
- low pressure operation
IONIX® 2'' UHV Magnetron
The IX2U ultrahigh vacuum magnetron sputtering source has a target diameter of 50.8 mm (2”) and can be used with non-ferromagnetic targets varying from 1 – 6 mm target thickness.
The IX2U features indirect cooling of the target and a threaded target clamping ring and a sliding anode allowing easy adjustment of the dark space gap when varying target thickness. The magnetron has a fully UHV compatible design utilizing only metallic seals and construction materials with low-outgassing rate. The IX2U is bakeable up to 200°C with its SmCo magnet array inserted and can be in DC, AC, RF and pulsed operation…
IONIX® 3'' UHV Magnetron
The IONIX® IX3U magnetron sputtering source has a target diameter of 76,2 mm (3‘‘) and can be used with non-magnetic targets of 4 – 8 mm thickness.
This magnetron features indirect cooling of the target. A discrete target clamping ring and a sliding anode enable to adjust the dark space gap for different target thicknesses. The magnetron is fully UHV compatible and it utilizes only metallic seals as well as construction materials with low-outgassing rate. It is bakeable up to 200 °C with its magnets mounted. It can operate in DC, AC, RF and pulsed power mode…
IONIX® 4'' UHV Magnetron
The IONIX® IX4U magnetron sputtering source has a target diameter of 101,6 mm (4‘‘) and can be used with non-magnetic targets of 4 – 10 mm
thickness.
This magnetron features indirect cooling of the target. A discrete target clamping ring and a sliding anode enable to adjust the dark space gap for different target thicknesses. The magnetron is fully UHV compatible and it utilizes only metallic seals as well as construction materials with low-outgassing rate. It is bakeable up to 200 °C with its magnets mounted. It can operate in DC, AC, RF and pulsed power mode…
IONIX® 5'' UHV Magnetron
The IONIX® IX5U magnetron sputtering source has a target diameter of 127 mm (5‘‘) and can be used with non-magnetic targets of 4 – 12 mm thickness.
This magnetron features indirect cooling of the target. A discrete target clamping ring and a sliding anode enable to adjust the dark space gap for different target thicknesses. The magnetron is fully UHV compatible and it utilizes only metallic seals as well as construction materials with low-outgassing rate. It is bakeable up to 200 °C with its magnets mounted. It can operate in DC, AC, RF and pulsed power mode…
IONIX® 6'' UHV Magnetron
The IONIX® IX6U magnetron sputtering source has a target diameter of 152,4 mm (6‘‘) and can be used with non-ferromagnetic targets of 6 – 12 mm thickness.
This magnetron features indirect cooling of the target. A discrete target clamping ring and a sliding anode enable to adjust the dark space gap for different target thicknesses. The magnetron is fully UHV compatible and it utilizes only metallic seals as well as construction materials with low-outgassing rate. It is bakeable up to 200 °C with its magnets mounted. It can operate in DC, AC, RF and pulsed power mode…
IONIX® 8'' UHV Magnetron
The IONIX® IX8U magnetron sputtering source has a target diameter of 200 mm (8‘‘) and can be used with non-ferromagnetic targets of 6 – 14 mm thickness.
This magnetron features indirect cooling of the target. A discrete target clamping ring and a sliding anode enable to adjust the dark space gap for different target thicknesses. The magnetron is fully UHV compatible and it utilizes only metallic seals as well as construction materials with low-outgassing rate. It is bakeable up to 200 °C with its magnets mounted. It can operate in DC, AC, RF and pulsed power mode…
Accessories and options
- chimney
- gas distribution
-
model for magnetics targets:
Fe 1 mm, Ni 2 - 3 mm - quick coupling f/t
- RF power line
- pneumatic shutter
- +/- 45° ex-situ tilt
- 40° in-situ tilt
- coax power jack or screw terminals
Assemblies
- chimney
- gas distribution
-
model for magnetics targets:
Fe 1 mm, Ni 2 - 3 mm - quick coupling f/t
- RF power line
- pneumatic shutter
- +/- 45° ex-situ tilt
- 40° in-situ tilt
- coax power jack or screw terminals