IONIX® 4'' HV Planar Magnetron Sputtering Source

Features

The IONIX® IX4 has a target diameter of 101,6 mm (4‘‘) and can be used with non-magnetic targets varying from 4 – 10 mm.

The IX4 features indirect cooling of the target. The magnet array is completely isolated from the cooling water. The anode shield can be adjusted to set the dark space gap for different target thicknesses. A magnetron model for magnetic target materials (4 … 5 mm Ni, 2 .. 3 mm Fe) is optionally available.

By means of the KF25 interface the sputtering source can be either mounted on a straight Ø1‘‘ or Ø3/4‘‘ tube or on a tilt. ISO or CF flange mounted sources are also available.

Technical Data

typeIONIX-4HV
model no.IX4_A135 – A138 / (_A120/A121)
formcircular / planar
diameter4” ± 0,2 mm, optional 100 mm
thickness4 to 10 mm
coolingindirect
dark space distance1,5 ± 0,5
diameter127 / 137 mm
height97,5 mm
weight3,5 kg
construction materialsSS, OF-Cu, PTFE
vacuum interfaceKF50 / KF25 / CF16 / CF25
proposed mounting styletube Ø1” x 300 mm

 

Cu, 15 Å/s; 1 kW, 20 cm
Al, 29 Å/s; 1 kW, 10 cm
Al, 14 Å/s; 1 kW, 15 cm
non-magnetic targets3 x 10-3 to 10-1 mbar Ar
best performance5 x 10-3 to 5 x 10-2 mbar Ar
He leak check≤ 1 x 10-8 mbar Ar * l/s
max. power, watts3000 W DC / 1500 W RF (**)
max. voltage, DC1000 V
max. current, DC10 A
rec. power supply 3 KW
connector DCscrew terminals
connector RF (**)type 7/16”
water flow1 l / (min x kW)
minimum flow2 l/min
inlet temperature≤ 30°C
max. pressure≤ 3 bar open drain
water tubesØ6xØ4 mm PTFE
magnet arraypermanent NdFeB
max. temperature60 °C

Accessories and options

Mounting options

* This value refers to the magnetron itself. The maximum power is determined by the target material and
its bonding or clamping technique.
** RF-Version requires special connector and/or installation. More details on request.

We reserve the right for technical changes in design and specifications without notice or obligations.

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