IONIX® Rectangular Magnetron Sputtering Sources
Features
- high-rate metallic sputtering
- RF sputtering of dielectric targets
- pulsed reactive mode sputtering for high rate
- deposition of dielectric thin films
- Standardized target widths
- Standardized interfaces (ISO/CF)
- Internal/external mounting
- Directly/indirectly cooled targets
- Internal gas distribution
IONIX® rectangular magnetron sputtering sources with advanced water cooling circuits are designed for industrial production purposes and are available in a wide range of widths and lengths. The utilized directed cooling water flow and multipolar magnet arrays accomodate the use of clamped targets at power levels of 20W/cm2 (Cr, Al) and above. The rectangular magnetron sputtering sources can be internally mounted with standard vacuum interfaces (KF, CF, ISO) or on external flanges with dimensions as requested by system design.
Technical Data
| Target width A | Target lenght B | Cathode width C | Cathode lenght D | Height H |
| 63 mm / 2,5‘‘ | 150 … 1500 mm | 111 mm | B + 47 | 64 |
| 75 mm / 3‘‘ | 250 … 1500 mm | 124 mm | B + 47 | 64 |
| 89 mm / 3,5‘‘ | 250 … 1500 mm | 136 mm | B + 47 | 71 |
| 100 mm / 4‘‘ | 300 … 1500 mm | 147 mm | B + 47 | 71 |
| 125 mm / 5‘‘ | 300 … 2500 mm | 172 mm | B + 47 | 71 |
| 150 mm / 6‘‘ | 300 … 2500 mm | 203 mm | B + 53 | 71 |
| 225 mm / 9‘‘ | 300 … 2500 mm | 278 mm | B + 53 | 81 |
| Target width A | Target lenght B | Cathode width C | Cathode lenght D | Height H |
| 63 mm / 2,5‘‘ | 150 … 1500 mm | 111 mm | B + 47 | 64 |
| 75 mm / 3‘‘ | 250 … 1500 mm | 124 mm | B + 47 | 64 |
| 89 mm / 3,5‘‘ | 250 … 1500 mm | 136 mm | B + 47 | 71 |
| 100 mm / 4‘‘ | 300 … 1500 mm | 147 mm | B + 47 | 71 |
| 125 mm / 5‘‘ | 300 … 2500 mm | 172 mm | B + 47 | 71 |
| 150 mm / 6‘‘ | 300 … 2500 mm | 203 mm | B + 53 | 71 |
| 225 mm / 9‘‘ | 300 … 2500 mm | 278 mm | B + 53 | 81 |
Interface options
High voltage power and cooling water lines need to be routed from the magnetron terminals to atmosphere. Standardized interfaces allow the use of standardized vacuum components like bellows, reducers, etc. We recommend the use ISO63 as vacuum interface.
Apart from that interface, a wide variety of different interfaces are available for IONIX® rectangular magnetrons sputtering sources to virtually fit all vacuum system constraints, vacuum environments and customer requirements.
ISO63 interface
CF-type interfaces
Mounting options
A variety of different mountings styles are available for IONIX® rectangular magnetrons sputtering sources to virtually fit all vacuum system constraints and vacuum environments.
Internal mounting
Internal IONIX® sputtering sources are mounted inside the vacuum chamber. Cooling water and power need to be routed from the magnetron terminals to atmosphere. The use of standard vacuum interface (ISO, KF, CF) enables the use of standardized vacuum components. The connection to the chamber wall/port can be made in a straight or angled configuration, in addition a variable ±45° tilt is available.
Cantilever design
The cantilever mounting style is often used in vacuum web coating machines. In this mounting style the magnetron is supported only on one end which allows easy insertation into the coating machine and enables quick target exchange and servicing. Depending on the size of the magnetron a variety of cantilevers are available. In addition to cantilevers for single magnetrons, this mounting style is also available for dual magnetron systems.
Drop-in design
A drop-in mounted sputtering source is installed hanging from a flange into the vacuum chamber. This flange serves as feed through for cooling water, power and sputter/reactive gas.
IONIX® drop-in example: 3” x 10” sputtering source
Flange mounted design
Flange mounted IONIX® sputtering sources are mounted on the atmospheric side of the chamber wall. Mounting sputtering source in this way is useful if space inside the vacuum chamber is restricted – however, the seal surface is bigger compared to internal mounted sputtering sources, as the full extent of the sputtering source must be sealed.
IONIX® flange mounting example: 5” x 17” sputtering source
Mechanical options
UHV versions
One of the biggest challenges for the coating of EUV optics is defined deposition of highly reflective multilayer coatings (e.g. Mo/Si, Mo/Be, Sc/Si). For this area of application TFC GmbH has designed special sputtering sources with 3.5” width and lengths of 12”/15”/24”. A key specification for this kind of magnetrons is the very low operating pressure of < 1 x 10-3 mbar, as well as the very good process stability and reproducability.
Bakeable up to 150°C
Water cooled anodes
During sputtering the anode will heat up as it is very close to the plasma and the electrical return for the plasma electrons. In some sputtering systems with radiant heaters or high temperature processes it is desirable to reduce this heating and directly cool the anode. The water cooling option of the anode is realised as a water cooling channel around the anode circumference, closed and sealed via welding- see pictures and scheme below.
Flange mounted design
Flange mounted IONIX® sputtering sources are mounted on the atmospheric side of the chamber wall. Mounting sputtering source in this way is useful if space inside the vacuum chamber is restricted – however, the seal surface is bigger compared to internal mounted sputtering sources, as the full extent of the sputtering source must be sealed.
Dual magnetrons
IONIX® Dual Magnetron Solutions
In the field of large area coatings often dielectrics or transparent conductive oxide (TCO) layers are deposited in a reactive sputtering process. Commonly a dual magnetron system is used for high rate reactive sputter deposition of these materials. Utilizing this method, a pair of magnetron sputtering sources is used, alternating roles as anode an cathode avoiding the disappearing anode problem.Also, dual magnetron systems can be used for reactive- or non reactive deposition of conductive materials if deposition rates should be high and coating time short.
IONIX® dual magnetron system are available in a variety of different, varying from small systems of target size 2”x15” for research or small-scale production to systems as large as 5”x117” for large-area coatings.
Magnet array options
IONIX® Magnet Array Options
IONIX® magnet arrays for standard target utilization
A high degree of target utilization and extended film homogeneity are contradicting performance issues for static depositions. The standard magnet configurations are calculated for stable operation and well defined plasma confinement with almost any target material on various thicknesses. These general purpose systems yield fair film homogeneity, high rates and good target utilization between 30 – 35%.
- Standard magnet array for general processing
- Economic trade-off for metallic and reactive sputtering
- Target utilization > (30 – 35) %
- Balanced magnetic field
- Plasma confined to the target region
IONIX® multiplor magnet arrays
We also offer more sophisticated magnet arrays for higher uniformity and higher target utilization for sputtering of metal targets.
- Multipolar magnet arrays
- Metallic targets Cr, Cu, Ti and Al
- Sputtering at high power levels
- Utilization > (40 – 50) %
In addition, we provide magnet arrays for reactive sputter deposition
- Si, NbOx and ITO targets
- Target utilization > (30 – 40) %
- Control of cross corner effect
IONIX® magnet arrays for ferromagnetic target materials
Special magnet arrays are available for ferromagnetic target of Ni, Fe, Co and their alloys.
IONIX® unbalanced magnet arrays
For ion-assisted substrate treatment, unbalanced magnet arrays can be supplied. We offer special versions with movable magnets or an electromagnetic coil, if a field adjustment of ion current densities to the substrates is wanted or necessary.