IONIX® 10'' HV Planar Magnetron Sputtering Source

Features

The IONIX® IX10 has a target diameter of 254 mm (10‘‘) and can be used with non-magnetic targets varying from 8 – 16 mm in small scale production systems. Optionally targets of 250 mm diameter can be used. The achievable film thickness homogeneity is ±5% on Ø150 mm substrates for selected materials, best distance will be between 50 – 120 mm and must be optimized for each sputtering target material.

The IX10 features indirect cooling of the target. The magnet array is completely isolated from the cooling water. A sliding anode enables to adjust the dark space gap for different target thicknesses. A magnetron model for magnetic targets ( 6 mm Ni ) is optionally available.

By means of the ISO63 interface the sputtering source can be either mounted on a straight Ø1‘‘ or Ø3/4‘‘ tube or on a tilt. ISO or CF flange mounted sources are also available.

Technical Data

typeIONIX-10HV
model no.IX10_A120 – A127
formcircular / planar
diameter10” ± 0,2 mm, optional 250 mm
thickness8 to 16 mm
coolingindirect
dark space distance2,5 ± 0,5
diameter294 / 306 mm
height85 / 102 mm
weight30,0 kg
construction materialsSS, OF-Cu, PTFE
vacuum interfaceISO63
proposed mounting styleISO hardware

 

Al, 52Å/s; 3 kW; 10 cm
Ti, 36Å/s; 3 kW DC; 6,5 cm
non-magnetic targets3 x 10-3 to 10-1 mbar Ar
best performance5 x 10-3 to 5 x 10-2 mbar Ar
He leak check≤ 1 x 10-8 mbar Ar * l/s
max. power, watts10 KW DC / 3 KW RF (**)
max. voltage, DC1000 V
max. current, DC25 A
rec. power supply 10 KW
connector DCscrew terminals
connector RF (**)**
water flow1 l / (min x kW)
minimum flow3 l/min
inlet temperature≤ 30°C
max. pressure≤ 3 bar open drain
water tubesØ8xØ6 mm PTFE
magnet arraypermanent NdFeB
max. temperature60 °C

Accessories and options

Mounting options

* This value refers to the magnetron itself. The maximum power is determined by the target material and
its bonding or clamping technique.
** RF-Version requires special connector and/or installation. More details on request.

We reserve the right for technical changes in design and specifications without notice or obligations.

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