IONIX® 3'' HV Planar Magnetron Sputtering Source

Features

The IONIX® IX3 high vacuum magnetron with target diameter of 76,2 mm (3‘‘) is widely used in thin film research and development.It is a versatile tool for small and economic R&D type thin film deposition systems. The target thickness can vary between 4 and 8 mm.

he IX3 features indirect cooling of the target with a thick membrane plate. The magnet array is completely isolated from the cooling water. The anode shield can be adjusted to set he dark space gap for different target thicknesses. A magnet array for magnetic target materials (3 mm Ni, 1 mm Fe) is optionally available.

By means of the KF25 interface the sputtering source can be either mounted on a straight Ø1‘‘ or Ø3/4‘‘ tube or on a tilt. ISO or CF flange mounted sources are also available.

Technical Data

typeIONIX-3HV
model no.IX3_A035 – A041
formcircular / planar
diameter3” ± 0,2 mm, optional 75 mm
thickness4 to 8 mm
coolingindirect / direct
dark space distance1,5 ± 0,5
diameter105 / 113 mm
height96 mm
weight2,8 kg
construction materialsSS, OF-Cu, PTFE
vacuum interfaceKF25 / CF16
proposed mounting styletube Ø1” x 300 mm
Al, 12 Å/s; 1 kW DC, 10 cm
Cu, 25 Å/s; 1 kW DC, 10 cm
non-magnetic targets3 x 10-3 to 10-1 mbar Ar
best performance5 x 10-3 to 5 x 10-2 mbar Ar
He leak check≤ 1 x 10-8 mbar Ar * l/s
max. power, watts1250 W DC / 750 W RF (**)
max. voltage, DC1000 V
max. current, DC5 A
rec. power supply 2 KW
connector DCscrew terminals
connector RF (**)type 7/16”
water flow1 l / (min x kW)
minimum flow2 l/min
inlet temperature≤ 30°C
max. pressure≤ 3 bar open drain
water tubesØ6xØ4 mm PTFE
magnet arraypermanent NdFeB
max. temperature60 °C

Accessories and options

Mounting options

* This value refers to the magnetron itself. The maximum power is determined by the target material and
its bonding or clamping technique.
** RF-Version requires special connector and/or installation. More details on request.

We reserve the right for technical changes in design and specifications without notice or obligations.

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