IONIX
Magnetron Sputtering
Sources
Taking care for our customers needs and for market demands for more than 30 years. The basics of the IONIX® planar magnetrons is our passion for technology and our deep knowledge of both physics and mechanical engineering. Customers all over the world need to rely on the highest processing quality and on technical specifications to enable cutting edge PVD processes for the technology of tomorrow.
The basics of the IONIX® planar magnetrons is our passion for technology and our deep knowledge of both physics and mechanical engineering. Taking care for our customers needs and for market demands for more than 30 years.
Customers all over the world need to rely on the highest processing quality and on technical specifications to enable cutting edge PVD processes for the technology of tomorrow.
Taking care for our customers needs and for market demands for more than 30 years.
Taking care for our customers needs and for market demands for more than 30 years. The basics of the IONIX® planar magnetrons is our passion for technology and our deep knowledge of both physics and mechanical engineering. Customers all over the world need to rely on the highest processing quality and on technical specifications to enable cutting edge PVD processes for the technology of tomorrow.
The basics of the IONIX® planar magnetrons is our passion for technology and our deep knowledge of both physics and mechanical engineering. Taking care for our customers needs and for market demands for more than 30 years.
Customers all over the world need to rely on the highest processing quality and on technical specifications to enable cutting edge PVD processes for the technology of tomorrow.
Taking care for our customers needs and for market demands for more than 30 years.
TFC GmbH - a reliable partner for magnetrons
- 3D-CAD magnetron design and construction
- design of high voltage and RF components
- custom-designed magnetrons
- calculation and simulation of magnetic fields in 3D
- measurement and verification of magnetic fields in 3D
- quality management
- assembly, cleaning and test techniques
IONIX® Magnetron Sputtering Sources
RIX®12 - IONIX® solution for
300 mm FFE
The IONIX® RIX®12 magnetron sputtering source has a target diameter of 300 mm and can be used with targets of 6 – 16 mm thickness.
Demonstrates an impressive uniformity of up to +/-1%, guaranteeing consistent deposition across the 8-inch wafer. The unique feature of the RIX®12 is its 100% Full Face Erosion capability. Unlike other systems, it avoids the formation of any redeposition zones on the target surface. This characteristic is crucial for maintaining stable processes over extended periods, contributing to prolonged maintenance cycles. The absence of redeposition zones ensures the stability of processes and extends the time between services.
For reactive processes we suggest to add our „Hidden Anode“. Combined with the 100% FFE, the RIX®12 enables cutting edge processing. This innovative technology enhances any system‘s capabilities for advanced manufacturing applications.
IONIX® Rectangular
Magnetrons
IONIX® rectangular magnetron sputtering sources with advanced water cooling circuits are designed for industrial production purposes and are available in a wide range of widths and lengths. The utilized directed cooling water flow and multipolar magnet arrays accomodate the use of clamped targets at power levels of 20W/cm2 (Cr, Al) and above. The rectangular magnetron sputtering sources can be internally mounted with standard vacuum interfaces (KF, CF, ISO) or on external flanges with dimensions as requested by system design.
IONIX® High Vacuum Planar Magnetron Sputtering Source
IONIX® high vacuum sputtering sources are available in a wide range of target sizes from 2” up to 12” diameter. With our profund knowledge of sputtering technology and our experience we are capable for special designs to serve almost any need and vacuum environment.
IONIX® high vacuum sputtering sources offer a wide range of magnetic and mechanical options, e.g. flange/internal mounted, tilt able/adjustable, magnetrons with electropneumatic shutters, balanced/unbalanced magnet arrays, magnet arrays for high target utilization, for enhanced film thickness uniformity or low operating pressure.
IONIX® UHV Magnetron
Sputtering Source
IONIX® ultrahigh vacuum sputtering sources are available in a wide range of target sizes from 1” up to 12” diameter. With our profund knowledge of sputtering technology and our experience we are capable for special designs to serve almost any need and vacuum environment.
IONIX® ultrahigh vacuum sputtering sources only contain metallic seals and can be baked with their magnet array up to 200°C. This feature enables sputter deposition in an ultra pure environment eliminating unintenional oxidation and nitridation of materials.
IONIX® ultrahigh vacuum sputtering sources offer a wide range of magnetic and mechanical options, e.g. flange/internal mounted, tilt able/adjustable, magnetrons with electropneumatic shutters, balanced/unbalanced magnet arrays, magnet arrays for high target utilization, for enhanced film thickness uniformity or low operating pressure.
IONIX® Magnetron Sputtering Sources
RIX®12 - IONIX® solution for
300 mm FFE
The IONIX® RIX®12 magnetron sputtering source has a target diameter of 300 mm and can be used with targets of 6 – 16 mm thickness.
Demonstrates an impressive uniformity of up to +/-1%, guaranteeing consistent deposition across the 8-inch wafer. The unique feature of the RIX®12 is its 100% Full Face Erosion capability. Unlike other systems, it avoids the formation of any redeposition zones on the target surface. This characteristic is crucial for maintaining stable processes over extended periods, contributing to prolonged maintenance cycles. The absence of redeposition zones ensures the stability of processes and extends the time between services.
For reactive processes we suggest to add our „Hidden Anode“. Combined with the 100% FFE, the RIX®12 enables cutting edge processing. This innovative technology enhances any system‘s capabilities for advanced manufacturing applications.
IONIX® Rectangular
Magnetrons
IONIX® rectangular magnetron sputtering sources with advanced water cooling circuits are designed for industrial production purposes and are available in a wide range of widths and lengths. The utilized directed cooling water flow and multipolar magnet arrays accomodate the use of clamped targets at power levels of 20W/cm2 (Cr, Al) and above. The rectangular magnetron sputtering sources can be internally mounted with standard vacuum interfaces (KF, CF, ISO) or on external flanges with dimensions as requested by system design.
IONIX® High Vacuum Planar Magnetron Sputtering Source
IONIX® high vacuum sputtering sources are available in a wide range of target sizes from 2” up to 12”. With our profund knowledge of sputtering technology and our experience we are capable for special designs to serve almost any need and vacuum environment.
IONIX® high vacuum sputtering sources offer a wide range of magnetic and mechanical options, e.g. flange/internal mounted, tilt able/adjustable, magnetrons with electropneumatic shutters, balanced/unbalanced magnet arrays, magnet arrays for high target utilization, for enhanced film thickness uniformity or low operating pressure.
IONIX® UHV Magnetron
Sputtering Source
IONIX® ultrahigh vacuum sputtering sources are available in a wide range of target sizes from 1” up to 12”. With our profund knowledge of sputtering technology and our experience we are capable for special designs to serve almost any need and vacuum environment.
IONIX® ultrahigh vacuum sputtering sources only contain metallic seals and can be baked with their magnet array up to 200°C. This feature enables sputter deposition in an ultra pure environment eliminating unintenional oxidation and nitridation of materials.
IONIX® ultrahigh vacuum sputtering sources offer a wide range of magnetic and mechanical options, e.g. flange/internal mounted, tilt able/adjustable, magnetrons with electropneumatic shutters, balanced/unbalanced magnet arrays, magnet arrays for high target utilization, for enhanced film thickness uniformity or low operating pressure.